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The hired candidate will have experience with Electrical Engineering, Computer Engineering or equivalent background. The candidate must understand the fundamental principles of semiconductor processing and/or semiconductor layout design. In addition, the hired candidate must have experience with software engineering coding or scripting. The hired candidate must also possess strong analytical skills, excellent written and verbal communication skills, and the ability to articulate difficult concepts to an audience with diverse technical backgrounds.
This role will be responsible for multiple aspects of our IBM Research design and tape out activities which may include kerf/scribe development, and data processing scripts and algorithms for tape-out operations and logistics. In this role the individual will develop code to manipulate design layouts for optimized tape out and processing to improve process yield or printability in advanced technology research and development.
This role will develop and optimize reticle Frames (also referred to as Kerfs or Scribes) bordering internal test chip design using CAD software. In addition, this role may develop and optimize reticle Frames (also referred to as Kerfs or Scribes) bordering internal test chip design using CAD software. This role will collaborate closely across Technology Development, Patterning, Metrology, Photolithography, Process Integration, Data Preparation, Design Services and Mask Release for the specification and verification of design, frame structures and placement requirements. In addition, this role will develop and utilize automation for frame synthesis and associated documentation for use during wafer fabrication.
